发明名称 Surface acoustic wave (SAW) component e.g. for mobile communications devices
摘要 The SAW component includes a quartz substrate, a piezoelectric thin film with a positive temperature coefficient of a delay arranged on the substrate, and an inter-digital electrode, which is arranged in such way, that it is connected with the piezoelectric thin film. The substrate has a given angle at the Euler angles,and which is chosen so that the substrate comprises a negative temperature coefficient of the delay at a predetermined expansion direction. The piezoelectric thin film comprises an thickness which is chosen so, that a basic mode of a surface acoustic wave is excited on the substrate, in which the component operates.
申请公布号 DE19803791(A1) 申请公布日期 1998.08.13
申请号 DE19981003791 申请日期 1998.01.30
申请人 MURATA MFG. CO., LTD., NAGAOKAKYO, KYOTO, JP 发明人 KADOTA, MICHIO, NAGAOKAKYO, JP
分类号 H03H9/145;H03H9/02;H03H9/25;(IPC1-7):H03H9/25;H03H9/64 主分类号 H03H9/145
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