发明名称 |
Surface acoustic wave (SAW) component e.g. for mobile communications devices |
摘要 |
The SAW component includes a quartz substrate, a piezoelectric thin film with a positive temperature coefficient of a delay arranged on the substrate, and an inter-digital electrode, which is arranged in such way, that it is connected with the piezoelectric thin film. The substrate has a given angle at the Euler angles,and which is chosen so that the substrate comprises a negative temperature coefficient of the delay at a predetermined expansion direction. The piezoelectric thin film comprises an thickness which is chosen so, that a basic mode of a surface acoustic wave is excited on the substrate, in which the component operates.
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申请公布号 |
DE19803791(A1) |
申请公布日期 |
1998.08.13 |
申请号 |
DE19981003791 |
申请日期 |
1998.01.30 |
申请人 |
MURATA MFG. CO., LTD., NAGAOKAKYO, KYOTO, JP |
发明人 |
KADOTA, MICHIO, NAGAOKAKYO, JP |
分类号 |
H03H9/145;H03H9/02;H03H9/25;(IPC1-7):H03H9/25;H03H9/64 |
主分类号 |
H03H9/145 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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