| 摘要 |
PROBLEM TO BE SOLVED: To improve the precision of board thickness and the precision of space between insulating layers, to reduce the manufacturing cost and to improve the lamination efficiency of a multilayer printed wiring board when it includes several internal layer printed wiring sheets. SOLUTION: Quick-curing resins 8 are formed by printing technology such as screen printing or roll coater method outside the manufacturing area of the internal layer printed wiring board 1 with half the thickness of the specified space between insulating layers. The adjacent internal layer printed wiring sheets 1 are bonded with each other through positioning pins 6 at a temperature lower than lamination heating conditions. By this method, the flow of insulating resin is prevented. Then the positioning pins 6 are eliminated and the board is heated and pressed. |
