Verfahren zur Herstellung einer einseitig beschichteten und mit einem Finish versehenen Halbleiterscheibe

摘要

The method involves treating a semiconducting plate to a double-sided finishing process and then applying a coating to one side of the plate. The plate is then subjected to a second process producing a double-sided finish. The finishing processes are selected from a group of processing methods which include double-sided polishing and double-sided fine grinding.