A probe card (10) for testing semiconductor wafers (12), and a method and system (82) for testing wafers (12) using the probe card (10) are provided. The probe card (10) includes an interconnect substrate (16) having contact members (20) for establishing electrical communication with contact locations (15) on the wafer (12). The probe card (10) also includes a membrane (18) for physically and electrically connecting the interconnect substrate (16) to the testing apparatus (78), and a compressible member (28) for cushioning the pressure exerted on the interconnect substrate (16) by the testing apparatus (78).
