| 摘要 |
<p>A process for dicing an object 6 comprises setting the object on a pressure sensitive adhesive sheet 10, the adhesive sheet comprising at least one layer of shrinkable film 2, an expansible film 4 and a pressure sensitive adhesive layer 1 for mounting the object; fixing the edges of the pressure sensitive adhesive sheet to a ring frame 5; dicing the object into chips; and shrinking the shrinkable film to thereby expand the chip spacings. The shrinkable and expensible films consist of a plastics material and the pressure sensitive adhesive may be base on a rubber, acrylic, silicone or polyvinyl ether. The object 6 may be a semi conductor wafer, a ceramic plate, a lead frame, a printed circuit board or a TAB tape.</p> |
