| 摘要 |
PROBLEM TO BE SOLVED: To enable easy and reliable formation of solder bumps at low costs. SOLUTION: A printing screen mask 2 having openings 2a, 2a,... arranged in the form of a lattice is applied onto a semiconductor chip 1 having pad area 11a, 11a,... exposed thereon, and then flux 3 is printingly applied on the chip 1 containing a predetermined zone of the pad areas 11a. Then respective openings of a punching die and punches are positioned above the respective pad areas 11a, a solder tape is inserted between the punching die and punches, the punches are moved down to punch out many solder pieces from the solder tape, and then these solder pieces are set on the respective pad areas 11a having the flux 3 printingly coated thereon. And the chip 1 having the solder pieces temporarily set thereon by the adhesive force of the flux 3 is heated at 220 to 230 deg.C to reflow the solder pieces, and thereafter the flux 3 is removed and cleaned to obtain solder bumps arranged in the form of a lattice. |
