| 摘要 |
PROBLEM TO BE SOLVED: To turn chip parts upside down only by turning stacked trays upside down by forming a recess at opposed locations on the flat opposite surfaces of the tray to receive chip type parts. SOLUTION: A grid-patterned frame 4 is provided on a first surface 2 on the top side of a base body 1 and a second surface 3 on the bottom side of the body 1 respectively to provide a plurality of recesses 5a, 5b arranged, in columns and rows, so as to be opposed to one another. And the recesses 5a on the surface 2 and the recesses 5b on the surface 3 are made symmetrical with respect to a plane. Each of the recesses 5a, 5b has four inclined side surfaces and a flat bottom so as to receive a chip type part 6. For mounting the parts on a circuit substrate of an automatic mounting machine, an empty storage tray is placed on a plurality of trays which are stacked, the storage tray having the same shape as the trays, and the trays are turned upside down. Thus the chip parts 6 stored in the recesses 5a are moved into the recesses 5b of the tray disposed on top of the recesses 5a so that bumps 6a can be directed downward. |
