| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a printed wiring board having excellent heat resistance by impregnating a papery or cloth base with an epoxy resin composition, laminating the obtained prepreg with an inner layer material having a circuit, roughening the surface of the obtained multi-layered laminate and forming a conductor layer on the roughened surface. SOLUTION: This prepreg is prepared by impregnating a papery or cloth base with an epoxy resin composition containing 100 pts.wt. epoxy resin, 1-30 pts.wt. normally epoxy-resin-soluble latent curing agent such as a guanidine derivative, 10 pts.wt. or below of a cure accelerator such as an imidazole compound and an agent to be roughened such as 40 pts.wt. or below of rubber or 50 pts.wt. or below of inorganic filler. This prepreg is laminated with an internal layer material having a circuit so that the prepreg may be situated on the top surface, and the assemblage is pressed at 120-170 deg.C. Then, the laminate is drilled and treated with a roughening agent such as an oxidizing agent or a solvent to form a surface-roughened laminate, and a conductor layer is formed on this surface with. e.g. a dry film resist after panel plating by e.g. electroless plating.</p> |
