| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic part mounting substrate and electronic part device which enables manufacture of such an electronic part device as semiconductor package causing no package cracking or having an good reliability. SOLUTION: A film-like organic die bonding material 3 is placed on a perforated support substrate 1. In this case, the film is bonded onto the substrate at temperature, pressure and in time which satisfy the condition to prevent the film from sagging from the perforations. Next a semiconductor chip 4 is placed and bonded onto the film. Even in this case, the semiconductor chip is bonded to manufacture a semiconductor device at temperature pressure and in time which satisfy the condition to prevent the film from extruding and dropping from the perforations, or the extruded sagged film from coming into contact with the a carrier base on which the support substrate is laced, as above.</p> |
