发明名称 |
Contact temperature probe with unrestrained orientation |
摘要 |
A combination contact temperature probe/wafer support includes a thermocouple enclosing probe head of low thermal mass and large contact area supported by a support means such that 1) there is a high thermal resistivity connection between the support means and the probe head, and 2) the probe head is self orienting under the weight of the wafer so that the contact area is maintained coplanar with the surface of the wafer.
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申请公布号 |
US5791782(A) |
申请公布日期 |
1998.08.11 |
申请号 |
US19950531602 |
申请日期 |
1995.09.21 |
申请人 |
FUSION SYSTEMS CORPORATION |
发明人 |
WOOTEN, DAVID;KREIN, BRUCE;SHI, JIANOU |
分类号 |
G01J5/12;G01J5/14;G01K1/14;G01K7/02;(IPC1-7):G01K1/00;G01K7/00 |
主分类号 |
G01J5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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