发明名称 Cooling system for enclosed electronic components
摘要 An enclosure contains, among other components, hard drive cartridges, graphics or other option cards, power supply and a CPU and its support chips. The total power in the whole enclosure is about 325W and the CPU consumes about 30W of this total. For design purposes the components are closely positioned and hence heat dissipation is an important problem. Plural fans, as hereinafter disclosed, are used to circulate air. For the hard drive cartridges a fan snapped into a sidewall of the enclosure draws air from apertures in the bottom through the cartridge and into a plenum. For the CPU, an impingement fan discharges air directly downward on a heat sink positioned over the chip and into the plenum. Bulk flow fans discharge air from air intake vents in side walls of the enclosure as well as air discharged from the hard drive and CPU through an internal wall into a separate sub-enclosure for the power supply and thence to the exterior. Conventional fans are used but are positioned and inter-related so that the noise level is tolerable.
申请公布号 US5793608(A) 申请公布日期 1998.08.11
申请号 US19960661817 申请日期 1996.06.11
申请人 SUN MICROSYSTEMS, INC. 发明人 WINICK, ALAN LEE;MITTY, NAGARAJ;HARPELL, GARY A.
分类号 G06F1/20;H01L23/467;(IPC1-7):H05K7/20 主分类号 G06F1/20
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