| 摘要 |
PROBLEM TO BE SOLVED: To package a flip-chip connection with a chip-size area by forming a protection film such as resist and a pattern such as silk around a position where a semiconductor chip on a substrate is mounted. SOLUTION: A protection film 5 that comprises, for example, a solder resist film and an etching resist film covers the surrounding of a position where a semiconductor chip 3 is mounted on an organic substrate 1. Then, a pattern such as silk for indicating a part-mounting position is formed on the protection film 5 around the position where the semiconductor chip 3 is mounted. Then, a bump 2 that is made of, for example, gold and solder is formed at the electrode pad of the semiconductor chip 3, and the semiconductor chip 3 is aligned to the bump 2 and a substrate pad 6 with its face down. After that, a resin 5 is allowed to flow to a gap between the semiconductor chip 3 and the substrate 1. Then, with the resin 4 that is wet and spread around the semiconductor chip 3, the protection film 5 and the pattern 7 are used as protection walls and a packaging area L2 is set to an area close to a semiconductor chip size L1.
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