发明名称 RESIN MOLDING AND ITS PRODUCTION
摘要 PROBLEM TO BE SOLVED: To obtain a resin molding having good adhesiveness and wettability by selecting the one in which the two-dimensional centerline average roughness Ra of the surface has a specified or smaller value, the ratio of the two-dimensional maximum height Rmax to the centerline average roughness Ra has a specified or smaller value, and the contact angle with a dropwise added wettability index standard solution has a specified or smaller value. SOLUTION: A work (package 4) molded from an epoxy resin composition and traveling on a conveyor 3 is irradiated with ultraviolet rays emitted from a transmission tube type mercury vapor lamp 1 having a peak wavelength of 185nm and arranged below the reflector 3 in an oven at an atmosphere temperature of about 65±5 deg.C in an ozone concentration of 50-70ppm for a definite time to modify the surface of the resin molding. This modification treatment permits at least a part of the surface to have the following surface properties: the two-dimensional centerline average roughness Ra is 100nm or below as measured on an about 3μm-side square and the relationship: Rmax/Ra<=10 (wherein Rmax is a two-dimensional maximum height as measured on an about 3μm-side square) is held, and the contact angleθis in the range:θ<=30 deg. (whereinθis the contact angle measured by adding dropwise about 12.50mg of a wettability index standard solution).
申请公布号 JPH10212365(A) 申请公布日期 1998.08.11
申请号 JP19970330643 申请日期 1997.12.01
申请人 MITSUI CHEM INC 发明人 HARUTA KOICHI
分类号 B29C71/04;C08J7/00;H05K3/38;(IPC1-7):C08J7/00 主分类号 B29C71/04
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