发明名称 |
Semiconductor integrated circuit having a plurality of semiconductor chips |
摘要 |
A central portion of a front surface of a first semiconductor chip is bonded to a first surface of a die pad of a lead frame via an elastic insulating film. A peripheral portion having electrodes of the front surface is outside of the die pad. With a back surface of the first semiconductor chip put in contact with a jig surface, wire bonding of the first semiconductor chip is performed. Then, with a second surface of the die pad opposite from the first semiconductor chip put in contact with a jig surface, a back surface of a second semiconductor chip is bonded to the back surface of the semiconductor chip via an adhesive. With the second surface of the die pad put in contact with a jig surface, wire bonding of the second semiconductor chip is performed.
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申请公布号 |
US5793108(A) |
申请公布日期 |
1998.08.11 |
申请号 |
US19960637347 |
申请日期 |
1996.04.25 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
NAKANISHI, HIROYUKI;ISHIO, TOSHIYA |
分类号 |
H01L25/18;H01L23/495;H01L25/065;H01L25/07;(IPC1-7):H01L23/34 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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