| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor micromachine in which dispersion in its characteristic is small and to provide its manufacturing method. SOLUTION: A semiconductor micromachine is provided with a substrate 12 and with a movable part 13 which is arranged so as to face the substrate 12 by keeping a gap part and which is supported by needlelike bodies 15. The moving part 13 is composed of a polycrystal Si thin film. The needlelike bodies 15 are composed of a polycrystal Si thin film constituted of crystal particles whose particle size is larger than that of the polycrystal Si thin film constituting the moving part 13. In addition, when the moving part 13 and the needlelike bodies 15 are formed, an Si thin film is formed on a substrate material on the side of the moving part and on a substrate material on the side of the needlelike bodies. |
