| 摘要 |
A plurality of ridge-shaped contact portions are formed on a wafer holder to extend in a direction parallel to the scanning direction, and chucking grooves for chucking the lower surface of a wafer are formed on these contact portions. The lower surface of the wafer is pushed up by movable members which are vertically movably arranged in the Z direction between the contact portions, thereby correcting any curve of the wafer in the transverse direction. Alternatively, the curve of the wafer is corrected by adjusting the pressure in a space defined by adjacent contact portions and the wafer.
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