| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heat-treating device which has an internal atmosphere having high temperature uniformity. SOLUTION: In first and second standby process, outside air flows in an enclosure, but does not reach the position of a substrate, because a shutter is closed while a cover is opened and, in a substrate delivery process, the outside air seldom flows in the enclosure and reaches the position of the substrate even when the substrate is received, because the exhaust is stopped while the cover and shutter are opened. Therefore, the temperature uniformity in the internal atmosphere of a substrate heat-treating device can be improved. |
