发明名称 |
Method of manufacturing semiconductor device |
摘要 |
A method of manufacturing a semiconductor device includes the steps of providing a semiconductor substrate; forming a gate electrode on the substrate; forming impurity regions on both sides of the gate electrode; forming a first sidewall on the side of the gate electrode; forming a second sidewall on the side of the first sidewall; forming a third sidewall on the side of the second sidewall; and selectively removing only the second sidewall to thereby form a contact area. It is possible to precisely form a fine contact area so that the size of a semiconductor device can be reduced.
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申请公布号 |
US5792671(A) |
申请公布日期 |
1998.08.11 |
申请号 |
US19960606186 |
申请日期 |
1996.02.23 |
申请人 |
LG SEMICON CO., LTD. |
发明人 |
LEE, BYOUNG JU |
分类号 |
C23F4/00;H01L21/28;H01L21/285;H01L21/336;H01L21/768;H01L23/522;H01L29/78;(IPC1-7):H01L21/265 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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