发明名称 THERMAL BARRIER FOR MOLDING LAMINATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermal barrier, an electrically conductive sheet of which is hard to be cut even through its repeated use in the thermal barrier, which is formed heatable by resistance heating by piling up a plurality of insulating boards under the condition that the electrically conductive sheet is continuous among the insulation boards under the condition that the electrically conductive sheet is bent at one edge face part of the insulation board so as to arrange the electrically conductive sheet among the insulation boards, in the thermal barrier for molding laminates used in a method for manufacturing copper clad laminates through heating with resistance heating by feeding electricity to a copper foil. SOLUTION: An electrically conductive sheet 12 is one produced by forming an insulator layer 122 on a metal 121. Further, each first electrically conductive sheet 12a is arranged at a portion, at which the electrically conductive sheet 12 is bent at one edge face part of one of insulation boards 11.... Furthermore, each second electrically conductive sheet 12b is arranged at a portion except the portion, at which the electrically conductive sheet 12 is bent at one edge face part of one of the insulation boards 11.... In addition, in the electrically conductive sheet 12, the first electrically conductive sheet and the second electrically conductive sheet slidably come into contact with each other.</p>
申请公布号 JPH10211626(A) 申请公布日期 1998.08.11
申请号 JP19970018194 申请日期 1997.01.31
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 MORI HIRONOBU;ICHIKI TSUTOMU;ARAKAWA SHINYA
分类号 B32B37/10;B29C43/18;B29C43/20;B29C43/52;B29K105/06;B29L31/34;(IPC1-7):B29C43/18;B32B31/20 主分类号 B32B37/10
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