Heat sink structure for fast network hubs

摘要

The genus of apparatus according to the teachings of the invention is characterized by use of a heat conducting elastomer which is compressed between an integrated circuit and a surface of a chassis made of heat conducting material such as Aluminum. The elastomer conducts heat from the integrated circuit to the surface of the chassis where it warms the entire chassis and is radiated to the ambient and removed by convection cooling. Since the chassis provides a much greater radiating and convection cooling surface, cooling of the integrated circuit is enhanced.