发明名称 HONEYCOMB SANDWICH PANEL WITH BURIED HEAT PIPE
摘要 PROBLEM TO BE SOLVED: To reduce a space required for a power supply line and a signal line and to mount an electronic equipment on a panel with a high density by providing the power supply line and the signal line for an electronic equipment mounted to a panel along a heat pipe and burying it into a honeycomb sandwich panel. SOLUTION: A panel has an electronic equipment 5 that is mounted inside the satellite body of the panel, a power supply line 6 for supplying power to the electronic equipment 5 along a heat pipe 3, and a signal line 7 of the electronic equipment 5. The heat pipes 3 are thermally connected and a network is formed so that heat can be carried to the entire panel surface. The power supply line 6 and the signal line 7 connected to each electronic equipment 5 are buried into the panel up to a position before an equipment-mounting position and a space for arranging the power supply line 5 and the signal line 6 is drastically reduced, thus narrowing the gap of the heat pipe and arranging a low heat-generating equipment at a reduced space and hence mounting the equipment to the panel with a high density.
申请公布号 JPH10215093(A) 申请公布日期 1998.08.11
申请号 JP19970018401 申请日期 1997.01.31
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAO AKIRA
分类号 B64G1/50;B32B3/12;F28D15/02;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 主分类号 B64G1/50
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