发明名称 ADHESIVE TAPE FOR ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To obtain the subject tape that is adherable at a relatively low temperature and secure the insulation properties and develop sufficient reliability by providing the adhesive layer with two kinds of polyimides having specific structural units, respectively. SOLUTION: This adhesive tape comprises at least a metal plate, an adhesive layer A and another adhesive layer B. Both of the layers A and B each contains at least one or more kinds of polyimides comprising 100-40mol% of at least one kinds of the structural unit of formula I (Ar is a divalent group bearing an aromatic ring; for example, of formula II) and the structural unit of formula III and 0-60mol% of at least one kinds of the structural unit of formula IV (R is -CH2 OC6 H4 - in which a 1-10C alkylene or methylene bonds to Si; n is an integer of 1-20) and the structural unit of formula V. The above-stated adhesive layers have different glass transition temperatures from each other. In a preferred embodiment, the glass transition temperature of the adhesive layer A is higher than that of the layer B.
申请公布号 JPH10212460(A) 申请公布日期 1998.08.11
申请号 JP19970029817 申请日期 1997.01.30
申请人 TOMOEGAWA PAPER CO LTD 发明人 OKA OSAMU;NISHIGAYA TAKESHI;TOCHIHIRA JIYUN;KOMAGATA FUMITADA
分类号 C08G73/10;C09J7/02;C09J179/08;H01L21/52;H01L21/60;H01L23/29;H01L23/31;(IPC1-7):C09J7/02 主分类号 C08G73/10
代理机构 代理人
主权项
地址