| 发明名称 |
Embedded metal planes for thermal management |
| 摘要 |
In order to dissipate heat from an electronic device, there is disclosed a method whereby with the use of metal planes embedded in an insulating substrate, heat generated by the electronic device can be transported and dissipated to a remote, more desirable location.
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| 申请公布号 |
US5792677(A) |
申请公布日期 |
1998.08.11 |
| 申请号 |
US19970784701 |
申请日期 |
1997.01.16 |
| 申请人 |
FORD MOTOR COMPANY |
发明人 |
REDDY, PRATHAP AMERWAI;JAIRAZBHOY, VIVEK AMIR;BELKE, JR., ROBERT EDWARD |
| 分类号 |
H01L23/367;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/367 |
| 代理机构 |
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