METHOD FOR MOUNTING WORK WITH BUMPS

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting a work with bumps in which the work mounted on a board can be repaired easily when the results of function test is rejectable. SOLUTION: Bumps 2 of a flip-chip 1 are applied with a paste 3 exhibiting conductivity even under uncured state before being mounted of the pads of a board 10. Function test of the flip-chip 1 is then performed by touching an inspection pad 12 with the probe 21 of an inspection means 20. When the test results are acceptable, underfill is injected between the flip-chip 1 and the board 10 and then the conductive paste 3 is thermally set along with the underfill. When the test results are rejectable, the flip-chip 1 is removed from the board 10 and residual conductive paste 3 on the board 10 is wiped off.