发明名称 COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve the process efficiency for mounting components on a small circuit board by providing two sets of imaging means and placing these means at both sides of heads. SOLUTION: Suction nozzles 13A, 13B of heads and cameras 11A, 11B are arrayed approximately in line in the carrying direction of a circuit board and two sets of the cameras 11A, 11B are disposed at both sides of the nozzles 13A, 13B and hence arrayed in line in direction X. Owing to this, it will suffice that an X-Y robot recognizes the feed position of the electronic components and suck them during moving in the direction X only, without being needed to move in direction Y. This improves the process efficiency and moving accuracy.
申请公布号 JPH10209688(A) 申请公布日期 1998.08.07
申请号 JP19970007702 申请日期 1997.01.20
申请人 JUKI CORP 发明人 TAKEGAWA YUJI;FUKUZAWA HIDEHIRO
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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