| 摘要 |
PROBLEM TO BE SOLVED: To enhance workability when a semiconductor chip is mounted on a circuit board by so-called chip-on-board system. SOLUTION: In the production of a semiconductor chip 10 having an anisotropic conductive film 30, a semiconductor wafer fabricated with a plurality of circuit elements is prepared and bumps 11 are formed on the electrode pads of each circuit element on the surface of the water. Subsequently, an anisotropic conductive film 30 is applied to the entire surface of the wafer which is then sectioned into respective circuit elements thus obtaining a semiconductor chip 10. |
