| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed circuit device which enables to prevent the generation of crack in a conductive junction material between a semiconductor element and a supporting board. SOLUTION: On a heat-radiating supporting board 1, a semiconductor element 3 is fixed by a solder 2 and a circuit board 5 is fixed by a solder 4. The semiconductor element 3 and the periphery are covered with a first protection resin layer 12a. The surfaces of the first protection resin layer 12a, the circuit board 5, and the supporting board 1 between the first protection resin layer and the circuit board are covered with a second protection resin layer 13a. The first and second protection resin layers 12a and 13a are made of a polyimide or polyether amide resin. The elastic coefficient of the first protection resin layer 12a is made greater than that of the second protection resin layer 13a. A resin sealing body 14 made of an epoxy resin is provided to cover the second protection resin layer 13a. |
