| 摘要 |
<p>PROBLEM TO BE SOLVED: To make alignment marks at a wafer reusable repeatedly in the exposure process steps using masks, without discarding after being used once. SOLUTION: A wafer alignment mark W1 of a first layer mask 11 is disposed outside a scribe line 42, a mask alignment mark M2 of a second layer mask 12 is disposed at a position corresponding to the mark W1 outside the scribe line 42, and the exposure regions of the mask 2 are limited to regions inside the scribe line 42. This makes it possible to use the wafer alignment mark W1 repeatedly in exposure steps, without transferring the alignment mark M2 to the mark W1 when the second layer alignment is made.</p> |
