| 摘要 |
PROBLEM TO BE SOLVED: To form a multilayer printed board having excellent adhesion, surface smoothness and other printed board performances, without volatilization of a solvent. SOLUTION: The manufacturing method comprises: (a) a step of coating the surface of a board, where a conductive circuit is formed, with powder coating material and baking the board to form an insulating coating film layer; (2) a step of forming a hole, which reaches the surface of the circuit under the insulating coating film layer, in the insulating coating film layer by laser; (3) a step of roughening the surface of the board having the hole, then copper- plating the surface to form a copper plating layer on the insulating coating film layer, such that the copper plating layer is electrically connected to the circuit under the insulating coating film layer via the copper plating formed in the hole; and (4) a step of processing the copper plating layer on the insulating coating film layer and forming a conductive circuit. The steps (1) to (4) are repeated for the surface of the board where the conductive circuit is formed at the step (4), in accordance with necessity. |
