发明名称 RESIN MOLDED BOX FOR ELECTRONIC APPARATUS, PRODUCTION EQUIPMENT THEREFOR, AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a part structure, in which a shielding material made of electrically conductive material and transferred and formed on the interior of a box in order to prevent electromagnetic wave developing within an apparatus from leaking outside comes into close contact with a resin material as the stock of the box especially surely in the neighborhood of a gate in the resin box for an electronic apparatus such as a personal computer or the like, and its manufacturing method. SOLUTION: At a position opposing to the gate 6 of a shielding material 1, which is made of an electrical conductor and is transferred to the surface of the interior of a box part for executing an in-mold molding, a hole 5 is provided so as to directly transmit the heat of the melted resin material 3 entering through the gate 6 at molding, resulting in refraining from the abrupt local temperature rise of the shielding material 1 at the starting of injection molding and consequently suppressing the change of the shape of the shielding material at molding.
申请公布号 JPH10211631(A) 申请公布日期 1998.08.11
申请号 JP19970015641 申请日期 1997.01.29
申请人 PFU LTD 发明人 SHUKUTANI TOSHIRO
分类号 B29C45/26;B29C45/14;B29C45/63;B29C45/73;B29K101/12;B29L31/34;H05K9/00;(IPC1-7):B29C45/14 主分类号 B29C45/26
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