| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for a through-hole in a dielectric substrate and to reduce transmission loss of an inductance component by forming a slot line, which cross the center lines of transmission lines of 1st and 2nd MMIC circuits at their tips on a ground metallic surface and utilizing microstrip-slot mode conversion for high-frequency signal transmission. SOLUTION: A dielectric substrate 10 has a 1st MMIC circuit 20 formed on its top surface and a 2nd MMIC circuit 30 on the reverse surface, and a slot line 45 is formed on the ground metallic surface of obtaining conduction between them. The transmitted high-frequency signal of the microstrip line of the 1st MMIC circuit changes its direction by 90 deg.C through microstrip-slot mode conversion at its end part A and is propagated in the slot line 45. Then mode conversion is performed again at a microstrip line end part B of a 2nd MMIC circuit 30 to make a direction change by 90 deg.. Further, respective end parts of the slot line 45 are formed in, for example, rectangular structure to prevent high-frequency signals from being reflected, thereby matching the impedance. |
