| 摘要 |
PROBLEM TO BE SOLVED: To reduce the mounting area, and increase the integrated capacity per unit mounting area, by enabling the stacking of package in lateral and longitudinal directions to be performed easily. SOLUTION: A groove is made of a plurality of barriers 3c projecting from one side of a rectangular package body 3 to store a semiconductor chip 2 inside, and a plateshaped connection member 5 is stuck to the surface of the barrier 3c, and the connection member 5 is electrically connected to the bonding pad 1 of a chip 2. The surface is covered with a sealing member 6, and it is made a rectangular block at large, and it is electrically connected by the connection member 5 stuck to the surface of the barrier projecting from its one side. |
