MANUFACTURE OF ELECTRONIC COMPONENTS HAVING INSULATION-COVERED LEADS

摘要

PROBLEM TO BE SOLVED: To allow an insulation cover to be formed on only leads of an electronic component. SOLUTION: An electronic component 1 having leads is positioned so as to bury specified lengths of the leads 3 in an unhardened resin 7 stored in a coating tank 13 and a movable plate 20 of the tank 13 is tilted down to take out the leads 3 from the resin bath and resin 7 applied to the leads 3 is hardened to form insulation covers.