SEMICONDUCTOR DEVICE, ITS MANUFACTURE, AND DEVICE FOR RESIN MOLDING PROCESS USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a technique for manufacturing a semiconductor device with a heat sink incorporated and exposed at the bottom face of a resin package by preventing defective items from being produced. SOLUTION: The method of manufacturing a semiconductor device having a heat sink 14 buried in a resin package, exposed at its bottom face comprises a step for bonding the heat sink 14 to the bottom of a die pad 12, using a lead frame 22 formed so as to involve the die pad, inner leads 16 and outer leads, a step for bonding a semiconductor chip 13 to the top face of the die pad 12, a step for electrically connecting the chip 13 to the inner leads 16, and a step for molding the chip 13, die pad and heat sink 14 being fixed to the bottom face of a cavity 70 of a die by exerting a suction force on a suction hole 80 of the bottom face of the die cavity 70.