PRODUCTION OF SEMICONDUCTOR AND WIRING BOARD FOR BGA

摘要

PROBLEM TO BE SOLVED: To produce a highly reliable BGA(ball grid array) package by increasing the production yield of BGA package. SOLUTION: A solder ball 5 is fixed to the lower surface of a wiring board 2 and fused to be connected electrically with the wiring pattern 10 on a wiring board 2. A die pad 14 for mounting a semiconductor element 15 mounted on the upper surface of the wiring board 2 and an adhesive layer is formed on the upper surface of the die pad 14. A semiconductor element is mounted on the adhesive layer after the solder ball 5 is fixed.