发明名称 RADIATION MECHANISM OF SEMICONDUCTOR DEVICE MOUNTED ON PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To restrain generation of a thermoelectromotive force and an electronic drift, and easily carry out inspection and check. SOLUTION: A water-cooling pipe 2 is arranged on one side of a cooling board 3 made of a metal. On the other side of the cooling board 3, a printed circuit board 7 is arranged, with a rubber-like plate 8 having good thermal conductivity provided between the boards. On the printed circuit board 7, an LSI 9 which is susceptible to heat or likely to generate heat is mounted. Over the printed circuit board 7, a metallic box 4 for closing the LSI 9 on the printed circuit board 7 is arranged. The box 4 and the printed circuit board 7 are compression-bonded and fixed to the cooling board 3 by a fixing member 12 such as a screw.
申请公布号 JPH10209358(A) 申请公布日期 1998.08.07
申请号 JP19970007636 申请日期 1997.01.20
申请人 ASIA ELECTRON INC 发明人 SAITO OKUTO;NIINUMA YASUO
分类号 H01L23/427;H01L23/40;H01L23/473;H05K1/05;H05K3/00;(IPC1-7):H01L23/473 主分类号 H01L23/427
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