PUSH-UP DEVICE IN DIE BONDER

摘要

PROBLEM TO BE SOLVED: To provide a push-up device in a die bonder capable of precisely vacuum-chucking semiconductor chips into a collet and enhanicing a manfuacting yield and quanlity of the die bonding. SOLUTION: In a push-up device in a die bonder in which a semiconductor chip 2 sticking to a mount sheet 5 is pushed up separated, and the separated semiconductor chip 2 is vacuum-chucked by a collet 1 and die-bonded, the semiconductor chip 2 sticking to the mount sheet 5 pushed up by a push-up pin 3 is synchronously lifted up in a state of vacuum-chucking by the push-up pin 3 and collet 1, and the semiconductor chip 2 is separated from the mount sheet 5.