| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the area excluding that of a display part by forming a semiconductor integrated circuit even on an opposite substrate and arranging it overlapping with a peripheral circuit, etc., on a matrix substrate. SOLUTION: On the opposite substrate 5, circuits such as a CPU and a memory are formed. On the matrix substrate 5, on the other hand, an active matrix circuit, and a gate line and source line driver circuit are provided and other circuits (e.g. a signal processing circuit) are also provided when necessary. The opposite substrate 6 is provided with an area 8 for a semiconductor integrated circuit of a thin film transistor(TFT) in addition to an opposite electrode 11. This opposite substrate 6 is provided with a bump 7 by using a conductive material such as gold (Au) and the opposite substrate 6 and matrix substrate 5 are put one over the other; and liquid crystal is injected, and the bump 7 is pressed against a terminal provided in a peripheral driving circuit area 9 on the matrix substrate 5. Lastly, liquid crystal 14 is made not to leak by using a sealant 13.</p> |
