| 摘要 |
PROBLEM TO BE SOLVED: To prevent an IC chip from peeling from a substrate film or being disabled, by using an IC sealing frame having at least specified modulus of longitudinal elasticity. SOLUTION: An IC sealing frame 1 is made of FRP including reinforcing fibers 2 extending along the frame and a resin matrix 3. The frame 1 has a modulus of longitudinal elasticity at least 80GPa and size of 5-20mm long, 5-20mm wide and 0.2-1.5mm thick, depending on the size of used IC chip. The reinforcing fibers are high-strength and high-elastic modulus ones e.g. C fibers, an the matrix is a thermosetting resin such as epoxy resin or thermoplastic resin such as nylon resin. Thus, the IC chip in an IC card hardly peels from a substrate film or malfunctions or is disabled due to a large bending stress. |
