| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of avoiding warping of a radiation board due to the heat at the time of reflowing as well as the peeling of the radiation board from a die pad, and provide a manufacturing method. SOLUTION: The semiconductor device is provided with a die pad 12 for mounting a semiconductor chip 13 as well as a radiation board 14 junction with the die pad 12 also externally dissipating the heat generated by the semiconductor chip 13. In such a constitution, as for the die pad 12, a nickel alloy is used, while as for the radiation board 14, a metal in the product of the Young's modulus and the thermal expansion coefficient of at most 0.0017(GPa/k), e.g. aluminum is used. |
