| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip capacitor which reduces the occupied space for mounting on a printed board and effectively prevents outer frames from mutually entangling at manufacturing. SOLUTION: For housing many outer frames 2 in specified space, even if an upper or lower half 2a, 2b of specified frame 2 is fitted between the upper and lower halves of other frame 2, the upper or lower halves of both frames 2 never mutually entangle or tightly fixed to thereby prevent the frame 2 from being broken owing to applied unreasonable force, because the max. vertical width of the upper and lower halves 2a, 2b is less than a min. remove between both halves 2a, 2b.</p> |
