| 摘要 |
PROBLEM TO BE SOLVED: To enable the optical alignment of a semiconductor laser and a photodiode with high accuracy by packaging at least either of the semiconductor laser or the photodiode on a substrate via plural bumps which are respectively separately and freely adjustable in heights. SOLUTION: The semiconductor laser LD2 is joined on a copper heat sink 5a joined onto a wiring board 1. The photodiode PD3 is bonded with the high accuracy onto the plural bumps 10 for height control on the copper heat sink 5b in such a manner as to be aligned to the light emission center of the LD2. The bumps 10 are made of metallic materials, such as gold or solder, or org. resins, etc., and are formed in a ball shape of about 200 to 500μm in diameter and 50 to 100μm in height. The PD3 is joined by thermal pressure bonding, etc., onto the bumps 10 by a high-accuracy mounter and may be packaged at <=± about 5μm in an X direction and Y direction. The bumps 10 are thereafter displaced by pressurization according to the variations, etc., in the Z direction of the LD2 and the PD3 for added alignment accuracy. |
