| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of parts and the number of processes also by reducing gold wires for electric connection without using brazing filler metal of a foil state as another part as usual. SOLUTION: This device is constituted so that a through hole 2 with a size smaller than an area of a lower surface of a semiconductor laser element 104 penetrating through from a loading part to an element attaching part 101 is formed on the semiconductor laser element 104 loading part of a sub-mount 1, and the brazing filler metal is filled up in the inside of the through hole 2. When it is manufactured, the through hole 2 is formed on the sub-mount 1, and the wire-shaped brazing filler metal 3 is inserted into the inside of the through hole 2, and the semiconductor laser element 104, sub-mount 1 and element attaching part 101 are fixed by melting the wire-shaped brazing filler metal 3 with heating. |
