发明名称 PACKAGE FOR STORAGE OF ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a package for storage of an electronic component which can store an electronic part requiring high-speed propagation of a signal in its inside, and operate the stored electronic component normally and besides stably for a long period. SOLUTION: This package comprises an insulating substrate 1, which has a wiring layer 5 where an electronic component 3 is connected and on the top of which a metallic frame 9 is brazed through brazing material 10, and a metallic cover 2, and this is arranged so as store the electric component 3 in its inside by attaching the metallic cover 2 to the metallic frame 9 brazed to the insulating substrate 1. In this case, the insulating substrate 1 is glass ceramics sintered substance of dielectric constant 7 or under and the wiring layer 5 is made of at least one kind of copper, silver, and gold, and besides the brazing material 10 to braze the metallic frame 9 to the insulating substrate 1 is 500 deg.C in fusing point, and also the width of the metallic frame 9 is 0.2-0.5mm, and the thickness is 0.5-1mm, and thickness/width being >=1.</p>
申请公布号 JPH10209313(A) 申请公布日期 1998.08.07
申请号 JP19970008751 申请日期 1997.01.21
申请人 KYOCERA CORP 发明人 HIRAKAWA TETSUO;FURUKUWA TAKESHI
分类号 B23K35/30;H01L23/02;H01L23/08;H01L23/10;(IPC1-7):H01L23/02 主分类号 B23K35/30
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