| 摘要 |
<p>PROBLEM TO BE SOLVED: To form high conductor at conductive lands, electrically connected to a flip-chip IC in a ceramic multilayer substrate, even after baking. SOLUTION: Through holes are formed in a green sheet 1, and the through holes are filled with conductor 2. Then conductor 3 (including conductor 3a of conductive lands in the top surface layer) is printed on the green sheet. All the green sheets are stacked and pressed. Then, conductor 3b is printed on the conductor 3a of the conductive lands, and baking is performed without pressing. Thus, a ceramic multilayer substrate is obtained. According to this manufacturing method, high conductor can be formed at the conductive lands even after baking.</p> |
