| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be produced easily while protecting the joint against fracture, and a production method. SOLUTION: Since pins 80 dedicated for mounting are provided at two or more corners on a joint face 11 and holes 21 are made in a printed board 20 at positions corresponding to the pins 80, the joint of the printed board 20 and a ceramic BGA board 10 can be protected against fracture. Since holes 21 having a larger diameter than the pin 80 are made depending on the tolerance in the outline of the ceramic BGA board 10 and provided with joint material 90, a high temperature solder ball 70, a metallized pad 60 and a eutectic solder 50 can be aligned easily and correctly by simply inserting the pins 80 into the holes 21. Furthermore, production is facilitated because the high temperature solder ball 70 and the eutectic solder 50 can be joined and aligned simultaneously through reflow. |
