| 摘要 |
PROBLEM TO BE SOLVED: To improve the contact and adhesion of a base metal film (BLM) to solder balls to be rearranged for the flip chip bonding. SOLUTION: In order to expose a BLM film 6a for laying solder balls in the regions just above Al electrode pads 2a, and BLM film 6b for rearrangement of the solder balls other than the just above regions the of Al electrode pad 2b, a photosensitive second layer polyimide film 7 is photolithographed and developed to form holes 7a, 7b, and polyimide film residues 7s often generate in the holes. The sputter etching using an Ar plasma gas is applied to remove the residues 7s, and then solder balls are formed. If an Ar-NF3 mixed gas is used, F is introduced in the film to reduce the dielectric const. of the polyimide film 7. |
