发明名称 INTEGRATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an integration device by which a complete isolation of elements as well as the miniaturization can be attained. SOLUTION: The first gland electrode 3 formed on the bottom part of GaAs substrate 2, the second gland electrodes 6 formed between a plurality of elements 4 and the third gland electrode 8 formed on a dielectric layer 7 formed on the GaAs substrate 2 are mutually connected by via holes 9 at the shorter intervals than 1/2 of the wave length of applicable signals. Through these procedures, the elements 4 can be completely isolated by covering the periphery of the elements 4 with a waveguide type shield. Furthermore, the intervals between the elements 4 can be shortened thereby enabling the integration degree to be increased for miniaturizing the integrated device.
申请公布号 JPH10209374(A) 申请公布日期 1998.08.07
申请号 JP19970008823 申请日期 1997.01.21
申请人 MURATA MFG CO LTD 发明人 ISHIKAWA YOHEI;SAKAMOTO KOICHI;TANAKA HIROAKI
分类号 H01L27/04;H01L21/822;H01L23/48;H01L23/552;H01L23/66;(IPC1-7):H01L27/04 主分类号 H01L27/04
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