| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip electronic component superior in conductivity of outer and inner electrodes, durability against thermal shocks, accuracy and reliability. SOLUTION: The electronic component comprises approximately a parallelepiped element 20 having an inner electrode 21, first face at which this electrode is exposed, and outer electrode 30 formed attached to specified position along the first face and second face adjacent to the first face. The film thickness of the electrode 30 increases from the end of the electric 30 on the second face to the first face, the angleθbetween the second face and the outer electrode end surface on the second face is set to less than specified angle to ensure the conductivity of the electrodes 30 and 21 and prevent the element 20 from cracking or outer electrode 30 from peeling from the element 20.
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