| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer circuit board which enables an electronic part to normally operate for a long period by realizing high-density formation of wiring conductor and by completely and firmly covering electrodes, bonding pads and the like of the mounted electronic part with resin filler and potting resin. SOLUTION: The multilayer circuit board comprises alternately deposited organic-resin insulating layer 2 and thin-film wiring conductive layer 3 on a board 1. The upper and lower thin-film wiring conductive layers 3 are electrically connected via through hole conductor 6 provided on the organic-resin insulating layer 2. Bonding pads 7, electrically connected to the thin-film wiring conductive layers 3 and to be connected to an external electronic part A, are provided on the upper surface of the top organic-resin insulating layer 2a. A central-line average height (Ra) of the exposed surface of the upper surface of the top organic-resin insulating layer 2 is 0.05μm<=Ra<=5μm, and the count value of the peak (Pc) of the roughness per a 2.5mm length of the surface, where 1μm<=Pc<=10μm holds, is 500 or greater; the count value where 0.1μm<=Pc<=1μm holds, 2500 or greater; the count value where 0.01μm<=Pc<=0.1μm holds, 12500 or greater.</p> |
